PPS

Short Description:

• Physical:
• Density: 1.66
• Bulk Density:
• Mold Shrinkage (Machine Direction):
• Mold Shrinkage (Transverse Direction):
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Viscosity (380℃.77HZ):
• Particle size (D50):
• Water Absorption (23°C-sat):
• Water Absorption (24h @23°C):
• Flammability(1.6 mm):
• Mechanical :
• Tensile Stress at Break (5 mm/min): 190
• Tensile Modulus at Break (1 mm/min):
• Elongation at Break (23℃):
• Flexural Modulus at Break (23℃):
• Flexural Strength at Break:
• Charpy Impact Strength @23℃ (V-notched): 9
• Charpy Impact Strength @-30℃ (V-notched): 9
• Unnotched Charpy Impact Strength @23℃: 55
• Co-eff.of Friction, Static/Dynamic:
• Thermal :
• Melting Temperature (10°C/min):
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa): 265
• Coeff. Of Linear Them. Expansion (parallel): 0.30
• Coeff. Of Linear Them. Expansion (normal): 0.45
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg):
• Melt Flow Rate (380℃, 5kg):
• Thermal expansion coefficient (T<Tg) along flow:
• Thermal expansion coefficient (T>Tg) along flow:
• Thermal expansion coefficient (T<Tg) across flow:
• Thermal expansion coefficient (T>Tg) across flow:
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃):
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz):
• Dissipation Factor (100Hz&1MHz):
• Dielectric Strength: 25
• Relative Permittivity (4 GHz): 4.2
• Dissipation Factor (4 GHz): 0.002
• Volume Resistivity:
• Surface Resistivity:
• CTI: ＞150
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h
• Injection Pressure: 30-100
• Injection Speed:
• Injection Molding Melt Temp.: 290-330
• Injection Molding Mold Temp.: 120-160
• Temperature Settings:
• Hopper Temperature:
• Gate:
• Process Temperature: