PPS

Short Description:

• CTI:
• Physical:
• Density: 1.72
• Bulk Density:
• Mold Shrinkage (Machine Direction): 0.15
• Mold Shrinkage (Transverse Direction): 0.65
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Flow Rate (316℃. 5Kg):
• Melt Viscosity (380℃.77HZ):
• Particle size (D50):
• Water Absorption (23°C-sat): 0.02
• Water Absorption (24h @23°C):
• Flammability(1.6 mm):
• Mechanical :
• Tensile Stress at Break (5 mm/min): 200
• Tensile Modulus at Break (1 mm/min): 17
• Elongation at Break (23℃): 1.3
• Flexural Modulus at Break (23℃): 18
• Flexural Strength at Break: 275
• Charpy Impact Strength @23℃ (V-notched): 9.5
• Charpy Impact Strength @-30℃ (V-notched): 9.5
• Unnotched Charpy Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic: /
• Thermal :
• Melting Temperature (10°C/min): 280
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa): 270
• Coeff. Of Linear Them. Expansion (parallel): 0.3
• Coeff. Of Linear Them. Expansion (normal): 0.45
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg):
• Melt Flow Rate (380℃, 5kg):
• Thermal expansion coefficient (T<Tg) along flow:
• Thermal expansion coefficient (T>Tg) along flow:
• Thermal expansion coefficient (T<Tg) across flow:
• Thermal expansion coefficient (T>Tg) across flow:
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃):
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz):
• Dissipation Factor (100Hz&1MHz):
• Dielectric Strength:
• Relative Permittivity (4 GHz):
• Dissipation Factor (4 GHz):
• Volume Resistivity: 10^(6-9)
• Surface Resistivity: 10^(6-9)
• CTI:
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h
• Injection Pressure: 30~100
• Injection Speed:
• Injection Molding Melt Temp.: 290~330
• Injection Molding Mold Temp.: 120~160
• Extrsuion/Blow Molding Melt Temp.:
• Temperature Settings:
• Hopper Temperature:
• Gate:
• Process Temperature: