PEEK

Short Description:

• Physical:
• Density: 1.30
• Bulk Density:
• Mold Shrinkage (Machine Direction): 1.0
• Mold Shrinkage (Transverse Direction): 1.3
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Flow Rate (316℃. 5Kg):
• Melt Flow Rate:
• Melt Viscosity (380℃.77HZ):
• Particle size (D50):
• Water Absorption (23°C-sat):
• Water Absorption (24h @23°C): 0.3
• Flammability(1.6 mm): V-0
• Ash Content:
• Moisture Content:
• Volatile:
• Mechanical :
• Tensile Stress at Break (5 mm/min): 110
• Tensile Modulus at Break (1 mm/min): 5.0
• Elongation at Break (23℃): 12
• Flexural Modulus at Break (23℃): 4.5
• Flexural Strength at Break: 165
• Charpy Impact Strength @23℃ (V-notched): 7.0
• Charpy Impact Strength @-30℃ (V-notched):
• Unnotched Charpy Impact Strength @23℃:
• Co-eff.of Friction, Static/Dynamic:
• Shore Hardness:
• Thermal :
• Melting Temperature (10°C/min): 343
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa):
• Tg（0°C/min）:
• Coeff. Of Linear Them. Expansion (parallel):
• Coeff. Of Linear Them. Expansion (normal):
• Flammability (0.3 mm):
• Flammability (3.0 mm):
• Glass Transition (Tg): 150
• Melt Flow Rate (380℃, 5kg):
• Thermal expansion coefficient (T<Tg) along flow:
• Thermal expansion coefficient (T>Tg) along flow:
• Thermal expansion coefficient (T<Tg) across flow:
• Thermal expansion coefficient (T>Tg) across flow:
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃):
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz):
• Dissipation Factor (100Hz&1MHz):
• Dielectric Strength:
• Relative Permittivity (4 GHz):
• Dissipation Factor (4 GHz):
• Volume Resistivity:
• Surface Resistivity: 10^6
• CTI:
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h or 120℃&5h(residual moisture<0.02%)
• Injection Pressure:
• Injection Speed:
• Injection Molding Melt Temp.: 180℃~210℃
• Injection Molding Mold Temp.:
• Extrsuion/Blow Molding Melt Temp.:
• Temperature Settings: 375/385/390/395/395℃(Nozzle)
• Hopper Temperature: Not greater than 100℃
• Gate: >2mm or 0.5×part thickness
• Process Temperature: