PEEK

Short Description:

• Physical:
• Density: /
• Bulk Density: 30.0
• Mold Shrinkage (Machine Direction): /
• Mold Shrinkage (Transverse Direction): /
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Viscosity (380℃.77HZ): 620.0
• Particle size (D50): 50.0
• Water Absorption (23°C-sat): 0.2
• Water Absorption (24h @23°C):
• Flammability(1.6 mm): /
• Mechanical :
• Tensile Stress at Break (5 mm/min): 97
• Tensile Modulus at Break (1 mm/min):
• Elongation at Break (23℃): 30
• Flexural Modulus at Break (23℃): 3.8
• Flexural Strength at Break: 160
• Charpy Impact Strength @23℃ (V-notched): 8.5
• Charpy Impact Strength @-30℃ (V-notched): /
• Unnotched Charpy Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic:
• Thermal :
• Melting Temperature (10°C/min): /
• Melting Point: 343.00
• Heat Deflection Temp. High Load (1.8 MPa): 152
• Coeff. Of Linear Them. Expansion (parallel): /
• Coeff. Of Linear Them. Expansion (normal): /
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg): 150
• Melt Flow Rate (380℃, 5kg): /
• Thermal expansion coefficient (T<Tg) along flow: /
• Thermal expansion coefficient (T>Tg) along flow: /
• Thermal expansion coefficient (T<Tg) across flow: /
• Thermal expansion coefficient (T>Tg) across flow: /
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃): 0.29
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz): /
• Dissipation Factor (100Hz&1MHz): /
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: /
• Surface Resistivity: /
• CTI: /
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h OR 120℃&5h(residual moisture<0.02%)
• Injection Pressure: /
• Injection Speed: /
• Injection Molding Melt Temp.: /
• Injection Molding Mold Temp.: /
• Temperature Settings: /
• Hopper Temperature: /
• Gate: /
• Process Temperature: 380℃~400℃