PEEK
Short Description:
Unfilled,Standard- Physical:
- Density: 1.30
- Bulk Density: /
- Mold Shrinkage (Machine Direction): 1.00
- Mold Shrinkage (Transverse Direction): 1.20
- Mold Shrinkage:
- Melt Flow Rate (337℃. 6.7Kg):
- Melt Viscosity (380℃.77HZ): /
- Particle size (D50): /
- Water Absorption (23°C-sat): 0.07
- Water Absorption (24h @23°C):
- Flammability(1.6 mm): /
- Mechanical :
- Tensile Stress at Break (5 mm/min): 98
- Tensile Modulus at Break (1 mm/min):
- Elongation at Break (23℃): 25
- Flexural Modulus at Break (23℃): 3.9
- Flexural Strength at Break: 165
- Charpy Impact Strength @23℃ (V-notched): 7.0
- Charpy Impact Strength @-30℃ (V-notched): /
- Unnotched Charpy Impact Strength @23℃: /
- Co-eff.of Friction, Static/Dynamic:
- Thermal :
- Melting Temperature (10°C/min): 343
- Melting Point: /
- Heat Deflection Temp. High Load (1.8 MPa): 152
- Coeff. Of Linear Them. Expansion (parallel): /
- Coeff. Of Linear Them. Expansion (normal): /
- Flammability (0.3 mm): /
- Flammability (3.0 mm): /
- Glass Transition (Tg): 150
- Melt Flow Rate (380℃, 5kg): 25
- Thermal expansion coefficient (T<Tg) along flow: /
- Thermal expansion coefficient (T>Tg) along flow: /
- Thermal expansion coefficient (T<Tg) across flow: /
- Thermal expansion coefficient (T>Tg) across flow: /
- Thermal expansion coefficient (T<Tg): 60
- Thermal expansion coefficient (T>Tg): 140
- Thermal conductivity (23℃): 0.29
- Electrical Properties:
- Dielectric Strength (60*60*1mm³): 23
- Relative Permittivity (100Hz&1MHz): 3.1
- Dissipation Factor (100Hz&1MHz): 0.004
- Dielectric Strength: /
- Relative Permittivity (4 GHz): /
- Dissipation Factor (4 GHz): /
- Volume Resistivity: 10^15
- Surface Resistivity: 10^15
- CTI: /
- Typical Processing Conditions:
- Drying Temp. / Time: 150℃&4h
- Injection Pressure: /
- Injection Speed:
- Injection Molding Melt Temp.: 355~375
- Injection Molding Mold Temp.: 175~205
- Temperature Settings: /
- Hopper Temperature: /
- Gate: /
- Process Temperature:
