PEEK
Short Description:
GF30%,Easy flow- Physical:
- Density: 1.52
- Bulk Density:
- Mold Shrinkage (Machine Direction): 0.30
- Mold Shrinkage (Transverse Direction): 0.90
- Mold Shrinkage:
- Melt Flow Rate (337℃. 6.7Kg):
- Melt Viscosity (380℃.77HZ):
- Particle size (D50):
- Water Absorption (23°C-sat): 0.40
- Water Absorption (24h @23°C):
- Flammability(1.6 mm): V-0
- Mechanical :
- Tensile Stress at Break (5 mm/min): 180
- Tensile Modulus at Break (1 mm/min):
- Elongation at Break (23℃): 2.5
- Flexural Modulus at Break (23℃): 11.0
- Flexural Strength at Break: 290
- Charpy Impact Strength @23℃ (V-notched): 10.0
- Charpy Impact Strength @-30℃ (V-notched): /
- Unnotched Charpy Impact Strength @23℃: /
- Co-eff.of Friction, Static/Dynamic:
- Thermal :
- Melting Temperature (10°C/min): 343
- Melting Point:
- Heat Deflection Temp. High Load (1.8 MPa): 330
- Coeff. Of Linear Them. Expansion (parallel): /
- Coeff. Of Linear Them. Expansion (normal): /
- Flammability (0.3 mm): /
- Flammability (3.0 mm): /
- Glass Transition (Tg): 150
- Melt Flow Rate (380℃, 5kg): 28
- Thermal expansion coefficient (T<Tg) along flow: 18
- Thermal expansion coefficient (T>Tg) along flow: 45
- Thermal expansion coefficient (T<Tg) across flow: 18
- Thermal expansion coefficient (T>Tg) across flow: 110
- Thermal expansion coefficient (T<Tg):
- Thermal expansion coefficient (T>Tg):
- Thermal conductivity (23℃): 0.3
- Electrical Properties:
- Dielectric Strength (60*60*1mm³): 25
- Relative Permittivity (100Hz&1MHz): 3.2
- Dissipation Factor (100Hz&1MHz): 0.005
- Dielectric Strength: /
- Relative Permittivity (4 GHz): /
- Dissipation Factor (4 GHz): /
- Volume Resistivity: 10^16
- Surface Resistivity: 10^16
- CTI: 150
- Typical Processing Conditions:
- Drying Temp. / Time: 150℃&3h or 120℃&5h(residual moisture<0.02%)
- Injection Pressure: /
- Injection Speed:
- Injection Molding Melt Temp.: 170℃~200℃
- Injection Molding Mold Temp.: /
- Temperature Settings: 365/370/375/385/385℃(Nozzle)
- Hopper Temperature: Not greater than 100℃
- Gate: >2mm or 0.5×part thickness
- Process Temperature:
