PEEK

Short Description:

• Physical:
• Density: 1.40
• Bulk Density:
• Mold Shrinkage (Machine Direction): 0.10
• Mold Shrinkage (Transverse Direction): 0.50
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Viscosity (380℃.77HZ):
• Particle size (D50):
• Water Absorption (23°C-sat): 0.30
• Water Absorption (24h @23°C):
• Flammability(1.6 mm): V-0
• Mechanical :
• Tensile Stress at Break (5 mm/min): 255
• Tensile Modulus at Break (1 mm/min):
• Elongation at Break (23℃): 1.7
• Flexural Modulus at Break (23℃): 25.0
• Flexural Strength at Break: 370
• Charpy Impact Strength @23℃ (V-notched): 9.0
• Charpy Impact Strength @-30℃ (V-notched): /
• Unnotched Charpy Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic:
• Thermal :
• Melting Temperature (10°C/min): 343
• Melting Point:
• Heat Deflection Temp. High Load (1.8 MPa): 330
• Coeff. Of Linear Them. Expansion (parallel): /
• Coeff. Of Linear Them. Expansion (normal): /
• Flammability (0.3 mm): /
• Flammability (3.0 mm): /
• Glass Transition (Tg): 150
• Melt Flow Rate (380℃, 5kg):
• Thermal expansion coefficient (T<Tg) along flow: 5.0
• Thermal expansion coefficient (T>Tg) along flow: 40
• Thermal expansion coefficient (T<Tg) across flow: 6.0
• Thermal expansion coefficient (T>Tg) across flow: 100
• Thermal expansion coefficient (T<Tg):
• Thermal expansion coefficient (T>Tg):
• Thermal conductivity (23℃): 2.0
• Electrical Properties:
• Dielectric Strength (60*60*1mm³):
• Relative Permittivity (100Hz&1MHz):
• Dissipation Factor (100Hz&1MHz):
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: /
• Surface Resistivity: /
• CTI: /
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&3h or 120℃&5h(residual moisture<0.02%)
• Injection Pressure: /
• Injection Speed:
• Injection Molding Melt Temp.: 180℃~210℃
• Injection Molding Mold Temp.: /
• Temperature Settings: 375/385/390/395/395℃(Nozzle)
• Hopper Temperature: Not greater than 100℃
• Gate: ＞2mm or 0.5×part thickness
• Process Temperature: