PEEK

Short Description:

• Physical:
• Density: 1.30
• Bulk Density: /
• Mold Shrinkage (Machine Direction): 1.00
• Mold Shrinkage (Transverse Direction): 1.20
• Mold Shrinkage:
• Melt Flow Rate (337℃. 6.7Kg):
• Melt Viscosity (380℃.77HZ): /
• Particle size (D50): /
• Water Absorption (23°C-sat): 0.07
• Water Absorption (24h @23°C):
• Flammability(1.6 mm): /
• Mechanical :
• Tensile Stress at Break (5 mm/min): 105
• Tensile Modulus at Break (1 mm/min):
• Elongation at Break (23℃): 20
• Flexural Modulus at Break (23℃): 4.1
• Flexural Strength at Break: 170
• Charpy Impact Strength @23℃ (V-notched): 5.0
• Charpy Impact Strength @-30℃ (V-notched): /
• Unnotched Charpy Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic:
• Thermal :
• Melting Temperature (10°C/min): 343
• Melting Point: /
• Heat Deflection Temp. High Load (1.8 MPa): 152
• Coeff. Of Linear Them. Expansion (parallel): /
• Coeff. Of Linear Them. Expansion (normal): /
• Flammability (0.3 mm): /
• Flammability (3.0 mm): /
• Glass Transition (Tg): 150
• Melt Flow Rate (380℃, 5kg): 85
• Thermal expansion coefficient (T<Tg) along flow: /
• Thermal expansion coefficient (T>Tg) along flow: /
• Thermal expansion coefficient (T<Tg) across flow: /
• Thermal expansion coefficient (T>Tg) across flow: /
• Thermal expansion coefficient (T<Tg): 45.00
• Thermal expansion coefficient (T>Tg): 120.00
• Thermal conductivity (23℃): 0.29
• Electrical Properties:
• Dielectric Strength (60*60*1mm³): 23
• Relative Permittivity (100Hz&1MHz): 3.1
• Dissipation Factor (100Hz&1MHz): 0.004
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: 10^15
• Surface Resistivity: 10^15
• CTI: /
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&4h
• Injection Pressure: /
• Injection Speed:
• Injection Molding Melt Temp.: 355~375
• Injection Molding Mold Temp.: 175~205
• Temperature Settings: /
• Hopper Temperature: /
• Gate: /
• Process Temperature: