PEI

Short Description:

• Physical:
• Density: 1.27
• Bulk Density: /
• Mold Shrinkage (Machine Direction): /
• Mold Shrinkage (Transverse Direction): /
• Mold Shrinkage: 0.5-0.7
• Melt Flow Rate (337℃. 6.7Kg): 7-15
• Melt Viscosity (380℃.77HZ): /
• Particle size (D50): /
• Water Absorption (23°C-sat): 0.25
• Water Absorption (24h @23°C):
• Flammability(1.6 mm): /
• Mechanical :
• Tensile Stress at Break (5 mm/min): 108
• Tensile Modulus at Break (1 mm/min): 3.5
• Elongation at Break (23℃): 15
• Flexural Modulus at Break (23℃): 3.2
• Flexural Strength at Break: 150
• Charpy Impact Strength @23℃ (V-notched): 6.5
• Charpy Impact Strength @-30℃ (V-notched): /
• Unnotched Charpy Impact Strength @23℃: /
• Co-eff.of Friction, Static/Dynamic:
• Thermal :
• Melting Temperature (10°C/min): /
• Melting Point: /
• Heat Deflection Temp. High Load (1.8 MPa): 193
• Coeff. Of Linear Them. Expansion (parallel): 0.52
• Coeff. Of Linear Them. Expansion (normal): 0.52
• Flammability (0.3 mm): V-0
• Flammability (3.0 mm): V-0
• Glass Transition (Tg): 217
• Melt Flow Rate (380℃, 5kg): /
• Thermal expansion coefficient (T<Tg) along flow: /
• Thermal expansion coefficient (T>Tg) along flow: /
• Thermal expansion coefficient (T<Tg) across flow: /
• Thermal expansion coefficient (T>Tg) across flow: /
• Thermal expansion coefficient (T<Tg): /
• Thermal expansion coefficient (T>Tg): /
• Thermal conductivity (23℃): /
• Electrical Properties:
• Dielectric Strength (60*60*1mm³): 32
• Relative Permittivity (100Hz&1MHz): 3.15
• Dissipation Factor (100Hz&1MHz): 0.0015
• Dielectric Strength: /
• Relative Permittivity (4 GHz): /
• Dissipation Factor (4 GHz): /
• Volume Resistivity: 10^15
• Surface Resistivity: 10^15
• CTI: 150
• Typical Processing Conditions:
• Drying Temp. / Time: 150℃&4~6h
• Injection Pressure: /
• Injection Speed: Moderate to High
• Injection Molding Melt Temp.: 350~400
• Injection Molding Mold Temp.: 140~180
• Temperature Settings: /
• Hopper Temperature: /
• Gate: /
• Process Temperature: