Semi-finished Products
Short Description:
Natural,Black- Physical:
- Density:
- Bulk Density:
- Mold Shrinkage (Machine Direction):
- Mold Shrinkage (Transverse Direction):
- Mold Shrinkage:
- Melt Flow Rate (337℃. 6.7Kg):
- Melt Viscosity (380℃.77HZ):
- Particle size (D50):
- Water Absorption (23°C-sat):
- Water Absorption (24h @23°C):
- Flammability(1.6 mm):
- Mechanical :
- Tensile Stress at Break (5 mm/min):
- Tensile Modulus at Break (1 mm/min):
- Elongation at Break (23℃):
- Flexural Modulus at Break (23℃):
- Flexural Strength at Break:
- Charpy Impact Strength @23℃ (V-notched):
- Charpy Impact Strength @-30℃ (V-notched):
- Unnotched Charpy Impact Strength @23℃:
- Co-eff.of Friction, Static/Dynamic:
- Thermal :
- Melting Temperature (10°C/min):
- Melting Point:
- Heat Deflection Temp. High Load (1.8 MPa):
- Coeff. Of Linear Them. Expansion (parallel):
- Coeff. Of Linear Them. Expansion (normal):
- Flammability (0.3 mm):
- Flammability (3.0 mm):
- Glass Transition (Tg):
- Melt Flow Rate (380℃, 5kg):
- Thermal expansion coefficient (T<Tg) along flow:
- Thermal expansion coefficient (T>Tg) along flow:
- Thermal expansion coefficient (T<Tg) across flow:
- Thermal expansion coefficient (T>Tg) across flow:
- Thermal expansion coefficient (T<Tg):
- Thermal expansion coefficient (T>Tg):
- Thermal conductivity (23℃):
- Electrical Properties:
- Dielectric Strength (60*60*1mm³):
- Relative Permittivity (100Hz&1MHz):
- Dissipation Factor (100Hz&1MHz):
- Dielectric Strength:
- Relative Permittivity (4 GHz):
- Dissipation Factor (4 GHz):
- Volume Resistivity:
- Surface Resistivity:
- CTI:
- Typical Processing Conditions:
- Drying Temp. / Time:
- Injection Pressure:
- Injection Speed:
- Injection Molding Melt Temp.:
- Injection Molding Mold Temp.:
- Temperature Settings:
- Hopper Temperature:
- Gate:
- Process Temperature:
